Optimizing PECVD a-SiC:H Films for Neural Interface Passivation - CMNE
Article Dans Une Revue Key Engineering Materials Année : 2023

Optimizing PECVD a-SiC:H Films for Neural Interface Passivation

Résumé

This work aims to optimize Plasma-Enhanced Chemical Vapour Deposition (PECVD) amorphous hydrogenated silicon carbide (a-SiC:H) as a conformal passivation layer for invasive microelectrode array (MEA) neural interface applications. By carefully tuning the PECVD deposition parameters, the composition, structure, electrical, and mechanical properties of the films can be optimized for high resistivity, low stress, and great resistance to chemical attack. This optimization will eventually allow a-SiC:H to be used as an ideal insulation, passivation and protection layer for thin and biocompatible all-SiC neural interfaces.
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Dates et versions

hal-04272217 , version 1 (14-11-2023)

Identifiants

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Scott Greenhorn, Konstantinos Zekentes, Edwige Bano, Valerie Stambouli, Andrei Uvarov. Optimizing PECVD a-SiC:H Films for Neural Interface Passivation. Key Engineering Materials, 2023, 947, pp.83-88. ⟨10.4028/p-762f40⟩. ⟨hal-04272217⟩
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